DIC Corporation and Unitika have come together to develop a specialty PPS film that has low dielectric properties. This film is ideal for millimeter-wave printed circuit boards and millimeter-wave radar. The newly developed PPS film aims to reduce transmission loss at high frequencies, making it a key material for next-generation communication devices.
The collaboration between DIC and Unitika has resulted in a product that has been well-received by electronics materials manufacturers. The low dielectric properties of this film make it a suitable choice for applications that require materials with minimal transmission loss, particularly in high-frequency environments.
Traditional high-frequency flexible printed circuit boards are made using liquid crystal polymer (LCP) film and copper foil. However, the interface between the LCP film and copper foil often leads to higher transmission loss. With the increasing use of the millimeter-wave frequency band in next-generation communication devices, materials with low dielectric properties are essential to minimize transmission loss.
The specialty PPS film developed by DIC and Unitika combines the strengths of both companies. It maintains the low moisture absorption, flame resistance, and chemical resistance of PPS resin, while offering exceptional low dielectric properties, dimensional stability, reflow resistance, and thickness uniformity required for high-frequency printed circuit boards.
This new film is designed to perform well in high-temperature environments and across a wide range of frequencies, from 10 to 1,000 GHz. Its stable dielectric properties make it a versatile option for various applications, from smartphones to automobiles.
One of the key advantages of this new film is its excellent adhesiveness with different materials. This means that it can be easily integrated into various flexible copper clad laminate (FCCL) processing methods, including sputtering, plating, and lamination with an adhesive.
The DIC Group is committed to developing functional materials that cater to the evolving needs of next-generation communications infrastructure, such as 5G/6G and generative AI. These technologies are expected to drive demand in the coming years, and the development of the specialty PPS film is a step towards meeting those demands.
DIC Corporation is a prominent player in the fine chemicals industry, with a global presence through its subsidiaries. The DIC Group is known for its innovative products in packaging materials, display materials, high-performance materials for smartphones and digital devices, and automotive materials.
Overall, the collaboration between DIC and Unitika to develop this specialty PPS film marks a significant advancement in the field of materials science. The new film is set to revolutionize the way high-frequency printed circuit boards are manufactured and pave the way for enhanced communication technologies in the future.
